Amatech Linkobond LDP88
Low dielectric, fire retardant polyurethane encapsulation and potting compound for insulation and gap filling.
Key Features
AMATECH™ Linkobond - LDP88 Gap Filler Compound is designed to provide weight management with efficient gap filling and medium thermal conductivity for filling the gap of various devices. A good material to keep assembly filled with good thermal conductivity level. Features include No Solvent composition, easy to mix and apply, good thermal conductivity, wide operating temperature [-40 – 190°C].
Applications
Application includes battery cell packs, lighting assemblies, telecom equipment, consumer devices, power supplies and components for transportation and power modules.