Amatech Linkobond TC954 & H75
Expandable, thermally conductive, electrically insulating close cell rigid urethane foam for encapsulation and potting.
Key Features
AMATECH™ Linkobond – TC954 & H75 Gap Filler Compound is designed for efficient gap filling of various devices. This is an advanced PU Cell Fill Technology. The material is design to expand upto 500% after mixing the two parts and form a porous cellular foam structure. Features include No Solvent composition, easy to mix and apply, wide operating temperature, pot life for 3-4 minutes after mixing and forms complete cellular structure in 20 minutes.
Applications
Application includes battery cell packs, lighting assemblies, telecom equipment, consumer devices, power supplies and components for transportation and power modules.